Главная -> Services & Capabilities -> HDI PCB Capabilities

Возможности печатных плат HDI

Surface Finish :

Flash Gold/Electrolytic Gold/OSP/ENIG/HASL/Lead Free HASL/Immersion Silver/Immersion Tin/Carbon Ink

Blind Vias:

3 mils / 4 mils Blind vias that connect any layers are not supported.
Please inquire if types of HDI stackups are III or higher orders.

Others +

Others –

Dimensions 610 mm * 710 mm Max.
50 mm * 50 mm Min.
Materials FR4/CEM-1/Aluminium/PFTE/Rogers
Board Thickness 0.3-2.4 mm, 3.2mm prototypes available

Inner Layers +

Inner Layers –

Trace / Space Etch compensation for inner layer cores (applicable to wet film cores only)
Compensation widths (um) Gaps after compensation (um) Annular ring after compensation (um) Artwork gaps before compensation (um) Artwork trace widths before compensation (um)
Base copper weight Individual traces Normal Min. Normal Min. Normal Local Min. Normal Min. Normal Min.
0,33 унции в час 36 26 16 70 56 150 90 89 76 89 76
1.5 OZ 50 45 35 80 80 180 120 125 115 106 80
2 OZ 70 60 50 100 100 250 150 160 150 150 120
2.5 OZ 110 90 80 110 110 280 230 200 190 165 135
3 OZ 140 120 100 120 120 300 250 240 220 180 150
4 OZ 190 140 120 150 130 400 350 310 250 250 200
5 OZ 230 200 180 180 150 450 380 380 330 250 200
6 OZ 280 250 220 250 200 530 470 500 420 280 250
Annular Ring Refer to the above table
Prepregs with DK 4.2-4.6 1080: 3-3.35 mils in thickness  
2116: 4.53-5.12 mils in thickness  
7628: 7.56-8.46 mils in thickness  
2113: 4 mils in thickness  
106: 2-2.36 mils in thickness  
1506 (not recommended): 6.3 mils in thickness  
7630 (not recommended): 8 mils in thickness

Drill +

Drill –

Dimensions Max.: 690 mm * 885 mm
Max. Panel Dimensions: 620 mm * 725 mm
Min. Drill Size 0.2 mm
Max. Drill Size 6.35 mm
Min. Diameter-to-Thickness Ratio 1 : 12
Drilling Compensation Finished diameter: D; Tolerance Upper Limit: L; Min. Wall Thickness (Single point): H
Board Thickness(mm) Surface Finish Compensation Calculator
(L ≤ 0.076mm,
L = 0.076mm if the upper limit is larger than 0.076mm)
Non Crimp PTHs Crimp PTHs
< 1.0 HASL D+L+(H+0.005)*2+0.01 D+L+H*2
Не HASL D+L+(H+0.005)*2 D+L+H*2
1.0 ≤ x < 5.0 HASL D+L+(H+0.005)*2+0.01 D+L+H*2+0.01
Не HASL D+L+(H+0.005)*2 D+L+H*2
≥ 5.0 HASL D+L+(H+0.005)*2+0.02 D+L+H*2+0.02
Не HASL D+L+(H+0.005)*2+0.01 D+L+H*2+0.01

Outer Layers +

Outer Layers–

Etching … 2nd Outer-most / Outer Layer Compensation
Artwork gaps before compensation (um) Max. copper thickness (um) Design copper thickness (um) Min. artwork trace width X (um) before Compensation Artwork trace width X / Gap Y before Compensation (um) Trace width compensation Min. gap after compensation (um) Min. trace width after compensation (um) PAD compensation (um) Impedance trace compensation A/R (um)
Trace-to-trace compensation (um) Gap Y1 after primary compensation (um) Dynamic compensation (um)
50 ≤ x < 60 25 20+/-4 40 100 ≤ X+Y 10 45<Y1≤ 55
55<Y1≤ 65
65<Y1≤75
75<Y1≤85
Y1>85		 5
9
12
14
19		 40 60 50 25 um as compensation width should be priorly applied For plated through holes,
60 ≤ x <70 30 25+/-4 50 120 ≤ X+Y 10 55<Y1≤ 65
65<Y1≤75
75<Y1≤85
85<Y1≤ 95
Y1>95		 6
10
13
16
20		 50 70 55 30 um as compensation width should be priorly applied
35 30+/-4 125 ≤ X+Y 65<Y1≤75
75<Y1≤85
85<Y1≤ 95
Y1>95		 6
12
16
20		 55 75
70 ≤ x <80 35 30+/-4 60 140 ≤ X+Y 65<Y1≤75
75<Y1≤85
85<Y1≤ 95
95<Y1≤ 105
Y1>105		 6
12
14
18
25		 60 85 60 35 um as compensation width should be priorly applied
90 ≤ x <100 44 39+/-4 80 166 ≤ X+Y 24 66<Y1≤80
80<Y1≤ 95
95<Y1≤ 115
115<Y1≤ 135
Y1>135		 6
14
20
25
35		 66 110 80 43 um as compensation width should be priorly applied For plated through holes,
100 ≤ x <125 49 44+/-4 90 200 ≤ X+Y 30 70<Y1≤ 85
65<Y1≤100
100<Y1≤125
125<Y1≤ 145
Y1>145		 8
16
22
30
40		 70 130 90 50 um as compensation width should be priorly applied For plated through holes,
Compensation widths (um) Impedance Trace Compensation Gaps after compensation (um) Annular ring after compensation (um) Artwork gaps before compensation (um Artwork trace widths before compensation (um)
Max. Copper Thickness (um) Individual traces Normal Dense Traces Normal Min. Normal Local Min. Normal Min. Normal Min.
X≤ 59 80 60 45 2nd outer-most… 90 80 180 100 150 125 125 100
X≤ 69 90 70 50 90 85 180 110 160 135 150 126
X≤ 79 100 80 55 100 90 180 130 180 145 175 150
X≤ 83 110 90 60 105 90 200 130 190 150 190 160
X≤ 89 120 95 70 125 100 230 160 220 170 200 176
X≤ 108 130 110 95 130 110 250 180 240 205 240 205
X≤ 115 150 140 120 150 120 270 200 270 230 270 230
X≤ 131 180 160 140 170 150 300 220 300 250 300 250
X≤ 149 210 180 160 200 170 300 250 330 280 330 280
A. Dynanic compensation should be applied if the sum of artwork trace width X + Gap Y before Compensation is less than 160 um.
B. For artwork with the Min. trace width, normal compensation widths should be priorly applied.
Trace / Space Refer to the above table
Trace – to – Copper At least 7 mils for electrolytic gold; at least 8 mils for 1 OZ copper board; at least 10 mils for 2 OZ copper board with 9 mils as the extreme.
Annular Ring Refer to the above table
Outline CNC copper to outline: at least 0.2 mm;V-cut: usually 0.7mm or wider for score lines, depending on V-cut depth and angle.

Pattern Plating +

Pattern Plating –

Max. Dimensions 200 mm * 1000 mm
Copper Thickness 1 – 6 OZ
Tin Thickness 200-400 u”
Hole Wall Thickness For gold plating board: 15um; For HASL board: 18-25um
Plugging Paste and Dry Film Tenting Capabilities of Dry Film Tenting
Process Board Thickness (mm) Max. Tenting Diameters (mm) Min. Annular Ring (Tenting Vias) @Max. Tenting Diameters (mm) Max. Slot Hole Tenting (mm) Dual Hole Tenting (mm)”
Outer Layer Negative Film 1.0 – 3.2 Φ 5.5 (PTH) 0.175 5.0 * 5.5 (PTH) Unavailable
< 1.0 Φ 4.0 (PTH) 0.175 3.5 * 4.0 (PTH) Unavailable
Outer Layer Positive Film 1.0 – 3.2 Φ 7.0 (NPTH) 0.175 6.5 * 7.0 (NPTH) 5.5
<1.0 Φ 5.5 (NPTH) 0.175 5.0 * 5.5 (NPTH) Unavailable
Notes:
1. The dry film photoresist is usually 0.2mm expanded by the hole edge. When the hole diameter is no less than 5mm, the annular ring must be 0.2 mm at least.
2. The table above is applicable to automated plugging equipment only, not applicable to vacuum plugging equipment.
For flex – rigid boards, vacuum plugging equipments are needed:
A. For positive film, the Max. tenting diameter is Φ 2.5 mm, the Max. slot hole is 1.0 mm * 3.0 mm; if NPTH hole > 2.5 mm, 2nd drilling is needed.
B. For negative film, the Max. tenting diameter is Φ 1.2 mm, the Max. slot hole is 1.0 mm * 2.0 mm; if PTH hole > 1.2 mm, go through the positive film process.

Electrolytic +

Electrolytic –

Nickel Thickness 100-200 u”
Gold Thickness Thin gold 1-2 u”, Thick gold ≤1um (ENIG is suggested if the plated area is over 40% of the total area)

Solder Mask +

Solder Mask –

Max. Dimensions 620 mm * 725 mm

Thickness +

Thickness –

Thickness Types of Coating Solder Mask Thickness (um)
Traces (A) Trace Corners (B) Copper Pour (C) Substrate (D)
Screen Printing Finished copper thickness < 60 um 10 – 25 5 – 20 10 – 35 Height over copper surface < 25 um
Finished copper thickness ≥ 60 um 15 – 50 10 – 40 20 – 35 Height over copper surface < 30 um
Low-Pressure, Electrostatic Spray Finished copper thickness < 60 um 30 – 50 15 – 35 40 – 60 Height over copper surface < 35 um
Finished copper thickness ≥ 60 um Unavailable. Linemask process supported with green / matte green solder resist if demanded.
* For boards that require ≤20 um in solder mask thickness over traces, the finished copper thickness should be no more than 40 um. The upper limit – 25 um in solder mask thickness over traces is advised . If not accepted, a review process is needed.
* For boards with BGA pitch ≤0.4 mm that require finished copper thickness within 40um, solder mask thickness by default is 30 um if no specific requirents are proposed. Only screen printing is available.

Solder Mask Bridge +

Solder Mask Bridge –

Solder Mask Bridge Position Finished Copper Thickness Glossy / Matte Green Glossy / Matte Black or White Glossy / Matte with other colors
Normal Extreme Normal Extreme Normal Extreme
Over Subtrate (A) ≤ 1 OZ ≥ 0.07 mm 0.06 mm ≥ 0.1 mm 0.09 mm ≥ 0.07 mm 0.065 mm
1 OZ – 2 OZ ≥ 0.09 mm 0.07 mm ≥ 0.125 mm 0.1 mm ≥ 0.1 mm 0.08 mm
≥ 2 OZ ≥ 0.1 mm 0.09 mm ≥ 0.15 mm 0.125 mm ≥ 0.12 mm 0.1 mm
Over Copper (B) / ≥ 0.125 mm 0.1 mm ≥ 0.15 mm 0.125 mm ≥ 0.15 mm 0.125 mm
BGA (C) Over Subtrate ≤ 1 OZ ≥ 0.055 mm 0.05 mm ≥ 0.08 mm 0.07 mm ≥ 0.07 mm 0.065 mm
1 OZ – 2 OZ ≥ 0.065 mm 0.055 mm ≥ 0.09 mm 0.075 mm ≥ 0.07 mm 0.065 mm
≥ 2 OZ ≥ 0.07 mm 0.06 mm ≥ 0.1 mm 0.09 mm ≥ 0.07 mm 0.065 mm
Over Copper / ≥ 0.125 mm 0.1 mm ≥ 0.15 mm 0.125 mm ≥ 0.15 mm 0.125 mm
Solder Mask Opening Normally 2 mils (>1 mil) expansion by the hole edge (BGA with 20 um expansion).
The distance from solder mask openings to traces should be more than 1.5 mils, usually 2.2 mils at the least.
Plugged Vias ≤0.6 mm on 2 sides
≤0.5 mm on 1 side, plugged vias on 1 side are unavailable with HASL.

Legend+

Legend–

Line Width / Height 4 mils/28 mils (0.7mm), 5 mils /35 mils (0.9mm)
2oz copper layer: 4 mils/28mil (0.7mm) . Pay attention to the Line width- to – Height Ratio.

ENIG+

ENIG–

Nickel Thickness 100-200 u”
Gold Thickness 1-3 u”

HASL+

HASL–

Tin Thickness 0.075 – 40 um

OSP+

OSP–

Film Thickness 0.2 – 0.5 um

CNC+

CNC–

Max. Dimensions 558 mm * 720 mm, segmently slotted if dimensions > 558 mm * 720 mm.
Milling Cutter Diameter 0.8 – 2.4 mm, Min. 0.5 mm
Tolerance ±0.15 mm or ±0.1 mm depending on requirements

V-cut+

V-cut–

Max. / Min. Dimensions Min. 150 mm * 150 mm, Max. 650 mm * 650 mm
Min. distance between scoring: 16 mm
Min. 70 mm * 70 mm, Max. 480 mm * 480 mm with manually operated machine, length to width ratio less than 3 : 1
Angle 20°, 30°, 45°, 60°, 90°

Bavel+

Bavel–

Angle 20°, 30°, 45°, 60°

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